The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Jan. 11, 2021
Applicants:

Qortek, Inc., Linden, PA (US);

Clive A. Randall, State College, PA (US);

Inventors:

Wei-Ting Chen, State College, PA (US);

Safakcan Tuncdemir, Lemont, PA (US);

Ahmet E. Gurdal, State College, PA (US);

Gareth J. Knowles, Williamsport, PA (US);

Clive A. Randall, State College, PA (US);

Assignee:

QorTek, Inc., Linden, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 30/00 (2023.01); H10N 30/057 (2023.01); H10N 30/50 (2023.01); H10N 30/853 (2023.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
H10N 30/1071 (2023.02); H10N 30/057 (2023.02); H10N 30/50 (2023.02); H10N 30/853 (2023.02); H10N 30/8536 (2023.02); H10N 30/8542 (2023.02); H10N 30/8554 (2023.02); H10N 30/8561 (2023.02); H10N 30/874 (2023.02); H10N 30/877 (2023.02);
Abstract

A wire-free multilayer biomorph device is provided where the layers are bonded without use of adhesive. The device includes a plurality of stacked perforated metal plates with interposed transductive assembly layers. The perforated metal plates and transductive assembly layers are bonded by a conductive metal ink that is subject to a thermal cycle process. Electrical connection of the perforated metal plates and transductive assembly are realized through structural connectors thru-connectors thereby obviating the need for wiring.


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