The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Aug. 17, 2021
Applicant:

Lenovo (Singapore) Pte. Ltd., New Tech Park, SG;

Inventors:

Bouziane Yebka, Apex, NC (US);

Tin-Lup Wong, Chapel Hill, NC (US);

Philip J. Jakes, Durham, NC (US);

Assignee:

Lenovo (Singapore) Pte. Ltd., New Tech Park, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); C09K 5/12 (2006.01); C09K 5/14 (2006.01); H01L 23/373 (2006.01); C09K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); C09K 5/12 (2013.01); C09K 5/14 (2013.01); C09K 5/00 (2013.01); H01L 23/3737 (2013.01);
Abstract

Thermal spreaders for targeted heat dissipation of an electronic component are disclosed. One thermal spreader includes a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component of a computing device while electrically insulating the electronic component. The thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component. Apparatus and systems including one or more of the thermal spreaders for targeted heat dissipation of one or more electronic components included therein are also disclosed.


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