The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Mar. 03, 2022
Applicant:

Amulaire Thermal Technology, Inc., New Taipei, TW;

Inventors:

Chi-An Chen, New Taipei, TW;

Tze-Yang Yeh, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 3/02 (2006.01); F28F 21/04 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
H05K 7/203 (2013.01); F28F 3/022 (2013.01); F28F 21/04 (2013.01); F28F 21/084 (2013.01); H05K 7/20409 (2013.01);
Abstract

An immersion-type liquid cooling heat dissipation sink is provided. The immersion-type liquid cooling heat dissipation sink includes a heat dissipation substrate layer and a surface film layer. The surface film layer is formed on the heat dissipation substrate layer. The heat dissipation substrate layer is a porous substrate that is immersed in an immersion-type coolant. A contact angle between the surface film layer and the immersion-type coolant is less than a contact angle between the heat dissipation substrate layer and the immersion-type coolant. A thickness of the surface film layer is less than an effective thickness of 5 μm.


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