The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

May. 05, 2020
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Raymond P. Johnston, Lake Elmo, MN (US);

Kevin W. Gotrik, Hudson, WI (US);

John J. Sullivan, Hudson, WI (US);

Kenneth A. P. Meyer, Eagan, MN (US);

Joseph C. Carls, Austin, TX (US);

Haiyan Zhang, Lake Elmo, MN (US);

Gregory L. Abraham, Austin, TX (US);

Matthew S. Stay, Bloomington, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/38 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01Q 1/38 (2013.01); H05K 1/0353 (2013.01); H05K 3/0014 (2013.01); H05K 3/103 (2013.01); H05K 3/207 (2013.01); H05K 3/244 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A patterned conductive articleincludes a substrateincluding a unitary layer-and includes a micropattern of conductive tracesembedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layerhaving a top major surfaceand an opposite bottom major surfacein direct contact with the unitary layer; and a unitary conductive bodydisposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewallsand at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.


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