The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Apr. 25, 2023
Applicants:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Toyota Jidosha Kabushiki Kaisha, Aichi-ken, JP;

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Shohei Nagai, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 1/0207 (2013.01); H05K 3/0061 (2013.01); H05K 7/20254 (2013.01); H05K 7/205 (2013.01);
Abstract

A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.


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