The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Mar. 27, 2020
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;
Hsiao-Ting Hsu, New Taipei, TW;
Ming-Jaan Ho, New Taipei, TW;
Katsumi Fujiwara, Shenzhen, CN;
Fu-Yun Shen, Shenzhen, CN;
Fu-Wei Zhong, Shenzhen, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;
Abstract
A covering film () includes a first covering layer (), a first adhesive layer (), and a thermal conductive layer () sandwiched between the first covering layer () and the first adhesive layer (). A thermal conductivity of the thermal conductive layer () is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer () is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer () is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.