The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Dec. 06, 2022
Applicant:

Triple Win Technology(shenzhen) Co. Ltd., Shenzhen, CN;

Inventor:

Kuei-Feng Peng, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 1/115 (2013.01); H05K 1/147 (2013.01); H05K 1/18 (2013.01); H05K 1/184 (2013.01); H05K 3/32 (2013.01); H05K 3/365 (2013.01); H05K 3/368 (2013.01); H05K 3/4038 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A camera module of reduced overall height includes multiple electronic components embedded in a PCB, multiple first holes defined on the PCB, each first hole enables a connection with one electronic component. A sensor chip is attached to the PCB by anisotropic conductive adhesive, multiple conductive balls on the sensor chip enter the multiple first holes and connect with the multiple electronic components. The embedded electronic components and the PCB form an integrated and single structure, avoiding multiple installations of electronic components one by one into the board and simplifying the manufacturing process of the camera module. The multiple conductive balls sinking into the multiple first holes reduce overall size of the camera module. A method for manufacturing the camera is also disclosed.


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Peng, Kuei-Feng. (2024). Camera module and manufacturing method thereof (U.S. Patent No. 12047662). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12047662

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