The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

May. 05, 2021
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Mikio Nakamura, Tokyo, JP;

Hiroaki Shibuya, Sakado, JP;

Takanori Sekido, Sagamihara, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/02 (2006.01); B23K 20/10 (2006.01); H01R 4/02 (2006.01); H01R 12/53 (2011.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H01R 4/021 (2013.01); H01R 12/53 (2013.01); H01R 12/57 (2013.01); H01R 43/02 (2013.01); H01R 43/0207 (2013.01); B23K 20/10 (2013.01); H01R 43/0256 (2013.01); Y10T 29/49174 (2015.01); Y10T 29/49181 (2015.01); Y10T 29/49183 (2015.01); Y10T 29/49185 (2015.01);
Abstract

A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.


Find Patent Forward Citations

Loading…