The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Apr. 24, 2023
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Takashi Matsumoto, Itano-gun, JP;
Naoki Harada, Tokushima, JP;
Fukutaro Saegusa, Anan, JP;
Yoshiyuki Kageyama, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 33/0095 (2013.01); H01L 33/642 (2013.01); H01L 24/00 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H01L 2924/19107 (2013.01); H01L 2933/0075 (2013.01);
Abstract
A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.