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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12046572 B1

PDFFull Text
Date of Patent:
Jul. 23, 2024

Filed:

Mar. 12, 2021

Bonding sheet and bonded structure

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Kei Anai, Ageo, JP;

Jung-Lae Jo, Ageo, JP;

Assignee:

Mitsui Mining & Smelting Co., Ltd., , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Adam Krupicka

Int. Cl.
CPC ...
H01L 23/00 (2006.01); B32B 15/01 (2006.01); C09J 1/00 (2006.01); C09J 7/28 (2018.01); B22F 7/08 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B32B 15/018 (2013.01); C09J 1/00 (2013.01); C09J 7/28 (2018.01); H01L 24/83 (2013.01); B22F 7/08 (2013.01); C09J 2203/326 (2013.01); C09J 2400/163 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29293 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01);
Abstract

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

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