The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Dec. 06, 2021
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventors:
Yuichiro Hinata, Nagano, JP;
Yuma Murata, Nagano, JP;
Naoyuki Kanai, Nagano, JP;
Ryoichi Kato, Nagano, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/58 (2006.01); H01R 43/02 (2006.01); H01G 2/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 23/58 (2013.01); H01R 43/0221 (2013.01); H01G 2/00 (2013.01);
Abstract
A semiconductor module includes a resin case housing a semiconductor element; an insulating layer extending outward from the resin case; and a first external connection terminal extending outward from the resin case, arranged above the insulating layer so as to face the insulting layer, the first external connection terminal having a non-contact portion that is not in contact with the insulating layer in a thickness direction of the insulating layer at a position overlapping the insulating layer in a plan view.