The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Oct. 20, 2021
Applicant:

Beijing Dream Ink Technologies Co., Ltd., Beijing, CN;

Inventors:

Zhenlong Men, Beijing, CN;

Zhongwei Ren, Beijing, CN;

Jiameng Kang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B22F 1/103 (2022.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/103 (2022.01); B22F 2201/02 (2013.01); B22F 2201/11 (2013.01); B22F 2201/20 (2013.01);
Abstract

A method for prepares low melting point metal particles, a conductive paste and a method for preparing the conductive paste, and relates to the technical field of functional materials. The method for preparing low melting point metal particles includes providing an organic resin carrier having fluidity, adding a low melting point metal material and the organic resin carrier into a sealed container for a vacuuming operation or filling a protective gas, making a temperature in the sealed container higher than the melting point of the low melting point metal and performing dispersion by stirring, and lowering the temperature, after performing the dispersion, to be below the melting point of the low melting point metal with continuous stirring during a cooling process to obtain low melting point metal particles dispersed in the organic resin carrier. Low melting point metal particles can be effectively prepared.


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