The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Feb. 09, 2021
Applicant:
Hutchinson Technology Incorporated, Hutchinson, MN (US);
Inventors:
Clark T. Olsen, Dassel, MN (US);
Jeffery G. Ribar, Brownton, MN (US);
Assignee:
Hutchinson Technology Incorporated, Hutchinson, MN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); C09J 5/00 (2006.01); C23C 2/02 (2006.01); C23C 16/02 (2006.01); C23F 1/02 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0012 (2013.01); C09J 5/00 (2013.01); C23C 2/024 (2022.08); C23C 16/0227 (2013.01); C23F 1/02 (2013.01); H01L 21/02263 (2013.01); H01L 21/0273 (2013.01); H01L 21/6836 (2013.01); H01L 21/76801 (2013.01); C09J 2203/326 (2013.01); C09J 2301/416 (2020.08); C09J 2433/00 (2013.01); C09J 2467/005 (2013.01); C09J 2467/006 (2013.01); H01L 2221/1084 (2013.01); H01L 2221/68345 (2013.01);
Abstract
A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.