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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12044626 B1

PDFFull Text
Date of Patent:
Jul. 23, 2024

Filed:

Jul. 05, 2022

Modular optical analytic systems and methods

Applicant:

Illumina, Inc., San Diego, CA (US);

Inventors:

Wenyi Feng, San Diego, CA (US);

Simon Prince, San Diego, CA (US);

Peter Clarke Newman, San Diego, CA (US);

Dakota Watson, San Diego, CA (US);

Stanley S. Hong, San Diego, CA (US);

Marco A. Krumbuegel, San Diego, CA (US);

Yinghua Sun, San Diego, CA (US);

Andrew James Carson, San Diego, CA (US);

Merek C. Siu, San Diego, CA (US);

Assignee:

ILLUMINA, INC., San Diego, CA (US);

Attorney:

Sheppard, Mullin, Richter & Hampton LLP

Primary Examiner:

Tarifur R Chowdhury

Assistant Examiner:

Amanda Merlino

Int. Cl.
CPC ...
G01N 21/85 (2006.01); C12Q 1/6869 (2018.01); G01N 15/1404 (2024.01); G01N 21/64 (2006.01); G02B 7/00 (2021.01); G01N 15/01 (2024.01); G01N 15/10 (2006.01); G01N 15/1434 (2024.01);
U.S. Cl.
CPC ...
G01N 21/85 (2013.01); C12Q 1/6869 (2013.01); G01N 15/1404 (2013.01); G01N 21/6458 (2013.01); G02B 7/003 (2013.01); G01N 15/01 (2024.01); G01N 2015/1006 (2013.01); G01N 2015/1452 (2013.01); G01N 2201/024 (2013.01);
Abstract

A system includes a plurality of modular subassemblies and a plate; wherein each modular subassembly comprises an enclosure and a plurality of optical components aligned to the enclosure, and each enclosure comprises a plurality of mounting structures; and wherein each modular subassembly is mechanically coupled to the plate by attachment of a mounting structure of the modular subassembly directly to a corresponding mounting structure located on the plate, such that by mechanically coupling each modular subassembly to the plate using the mounting structure of the modular subassembly and the corresponding mounting structure on the plate, adjacent modular subassemblies are aligned to each other upon such attachment, and wherein two of the modular subassemblies mechanically coupled to the plate are also attached to each other by mechanically coupling an alignment structure on one of the two modular subassemblies to a respective alignment structure on the other of the two modular subassemblies.

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