The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Oct. 16, 2019
Applicant:
Sumitomo Chemical Company, Limited, Tokyo, JP;
Inventors:
Hirofumi Kato, Osaka, JP;
Kenichi Takeuchi, Osaka, JP;
Assignee:
SUMITOMO CHEMICAL COMPANY, LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/4007 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08J 5/249 (2021.05); C08J 2363/02 (2013.01);
Abstract
An epoxy resin composition and a cured product thereof are provided, the epoxy resin composition comprising an epoxy resin (A), a curing agent (B) comprising a compound represented by the following formula (B-1) (wherein Rrepresents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms), and an imidazole adduct-type curing accelerator (C), wherein the molar ratio of the content of a phenolic hydroxide group to the content of an epoxy group in the epoxy resin composition is 0.25 to 0.67.