The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Apr. 08, 2022
Applicant:

Infineon Technologies Dresden Gmbh & Co. KG, Dresden, DE;

Inventors:

Dirk Meinhold, Dresden, DE;

Steffen Bieselt, Wehlen, DE;

Claudia Hengst, Dresden, DE;

Daniel Koehler, Chemnitz, DE;

Erhard Landgraf, Dresden, DE;

Sebastian Pregl, Dresden, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); H01L 27/1203 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01);
Abstract

A sensor system with a first semiconductor die part and with a second semiconductor die part is proposed, wherein the first semiconductor die part has a microelectromechanical sensor element, wherein the second semiconductor die part covers the microelectromechanical sensor element, wherein the second semiconductor die part has a via for electrically contacting the microelectromechanical sensor element, in particular directly. A method for producing a sensor system is also proposed.


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