The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2024

Filed:

Dec. 05, 2019
Applicant:

Rapiscan Systems, Inc., Torrance, CA (US);

Inventors:

Evgeniy Kuksin, Woodland Hills, CA (US);

Neal Hartsough, Fullerton, CA (US);

William C. Barber, Ventura, CA (US);

Assignee:

Rapiscan Systems, Inc., Torrance, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 3/26 (2006.01); B32B 7/14 (2006.01); B32B 37/18 (2006.01); C09J 5/06 (2006.01); C09J 7/35 (2018.01); C09J 9/02 (2006.01); C09J 163/00 (2006.01); C09J 183/04 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1292 (2013.01); B32B 3/266 (2013.01); B32B 7/14 (2013.01); B32B 37/1207 (2013.01); B32B 37/18 (2013.01); C09J 5/06 (2013.01); C09J 7/35 (2018.01); C09J 9/02 (2013.01); C09J 163/00 (2013.01); C09J 183/04 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 27/1463 (2013.01); H01L 27/14683 (2013.01); B32B 2305/72 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2309/025 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01); C09J 2483/00 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/83862 (2013.01);
Abstract

A method of attaching a detector onto a substrate that has an array of electrically conducting pads is provided, together with the resulting detector assembly. The method includes pouring a non-conductive adhesive material over a substrate surface, allowing the adhesive to settle between the conducting pads to form dams around the conducting pads, applying a conductive adhesive material onto the conducting pads of the substrate, and placing a surface of the detector on the substrate surface over the conducting and non-conducting adhesives to thereby attach the surface of the detector to the surface of the substrate.


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