The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Aug. 19, 2022
Hewlett-packard Development Company, L.p., Spring, TX (US);
Sterling Chaffins, Corvallis, OR (US);
Cassady Sparks Roop, Corvallis, OR (US);
Kevin P. Dekam, Corvallis, OR (US);
Vladek Kasperchik, Corvallis, OR (US);
Ali Emamjomeh, San Diego, CA (US);
Johnathon Holroyd, Corvallis, OR (US);
Stephen G. Rudisill, San Diego, CA (US);
Alexey S. Kabalnov, San Diego, CA (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.