The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2024
Filed:
Sep. 27, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Hidenobu Maruyama, Azumino, JP;
Kenta Anegawa, Matsumoto, JP;
Assignee:
SEIKO EPSON CORPORATION, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/03 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); B29C 45/17 (2006.01); B29C 45/76 (2006.01); B29C 45/84 (2006.01);
U.S. Cl.
CPC ...
B29C 45/03 (2013.01); B29C 45/0055 (2013.01); B29C 45/14 (2013.01); B29C 45/16 (2013.01); B29C 45/1769 (2013.01); B29C 45/76 (2013.01); B29C 45/84 (2013.01); B29C 2045/1797 (2013.01);
Abstract
An injection molding system includes a main unit in which a first injection molding machine that injects a first molding material and molds a molded article is disposed and a control unit separated from the main unit and configured to control the first injection molding machine. The control unit is coupled to the main unit via a connection cable having predetermined length.