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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12042859 B1

PDFFull Text
Date of Patent:
Jul. 23, 2024

Filed:

Apr. 12, 2018

Build material composition

Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Tienteh Chen, San Diego, CA (US);

Vladek Kasperchik, Corvallis, OR (US);

Assignee:

Hewlett-Packard Development Company, L.P., Spring, TX (US);

Attorney:

Dierker & Kavanaugh, P.C.

Primary Examiner:

Samir Shah

Assistant Examiner:

Dean Mazzola

Int. Cl.
CPC ...
B22F 1/10 (2022.01); B22F 1/05 (2022.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 10/10 (2021.01); B22F 10/14 (2021.01); B22F 10/73 (2021.01); B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); C08F 2/22 (2006.01); C08F 212/08 (2006.01); C08F 220/14 (2006.01); C08K 3/11 (2018.01); C09D 11/037 (2014.01); C09D 11/322 (2014.01); C09D 11/38 (2014.01); B22F 10/28 (2021.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B22F 1/10 (2022.01); B22F 1/05 (2022.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 10/10 (2021.01); B22F 10/14 (2021.01); B22F 10/73 (2021.01); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); C08F 2/22 (2013.01); C08F 212/08 (2013.01); C08F 220/14 (2013.01); C08K 3/11 (2018.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); B22F 10/28 (2021.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B82Y 30/00 (2013.01);
Abstract

An example of a composition includes a host metal present in an amount of at least about 90 wt % based on a total weight of the composition. A flow additive is also present in an amount of less than about 10 wt % based on the total weight of the composition. The flow additive consists of an organic particle having crosslinked polymer chains, a glass transition temperature (T) of at least 90° C., and a primary particle diameter of 100 nm or less.

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Quick Actions:

Chen, Tienteh. (2024). Build material composition (U.S. Patent No. 12042859). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12042859

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