The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Oct. 22, 2021
Applicant:
Huawei Technologies Co., Ltd., Shenzhen, CN;
Inventors:
Assignee:
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 7/20336 (2013.01);
Abstract
A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.