The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Sep. 24, 2019
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Hiroyuki Tajiri, Kyoto, JP;

Kenji Sakai, Kyoto, JP;

Kazuyoshi Izumi, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2021.01); H01S 5/02212 (2021.01); H01S 5/0231 (2021.01);
U.S. Cl.
CPC ...
H01S 5/0231 (2021.01); H01S 5/022 (2013.01); H01S 5/02212 (2013.01);
Abstract

A semiconductor laser device Acomprises a semiconductor laser chipand a stem. The stemincludes a baseand leadsA,B, andC fixed to the base, and supports the semiconductor laser chip. The semiconductor laser device Afurther comprises a first metal layerincluding a first layercovering the baseand the leadsA,B, andC, a second layerinterposed between the first layerand each of the baseand the leadsA,B, andC, and a third layerinterposed between the second layerand each of the baseand the leadsA,B, andC. Crystal grains in the second layerare smaller than crystal grains in the third layer. Such a configuration can suppress corrosion.


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