The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Sep. 29, 2022
Applicant:

Pixart Imaging Inc., Hsin-Chu, TW;

Inventors:

Yi-Chang Chang, Hsin-Chu, TW;

Yen-Hsin Chen, Hsin-Chu, TW;

Chi-Chih Shen, Hsin-Chu, TW;

Assignee:

PIXART IMAGING INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); G01J 5/00 (2022.01); G01J 5/04 (2006.01); G01J 5/20 (2006.01); H01L 27/146 (2006.01); H01L 31/0236 (2006.01); H01L 31/0216 (2014.01); H01L 31/024 (2014.01); H01L 31/09 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); G01J 5/00 (2013.01); G01J 5/0025 (2013.01); G01J 5/045 (2013.01); G01J 5/20 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H01L 31/02363 (2013.01); G01J 2005/206 (2013.01); H01L 27/14601 (2013.01); H01L 31/02164 (2013.01); H01L 31/024 (2013.01); H01L 31/095 (2013.01);
Abstract

An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.


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