The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Apr. 19, 2023
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Jong Hyeon Chae, Ansan-si, KR;

Seong Gyu Jang, Ansan-si, KR;

Ho Joon Lee, Ansan-si, KR;

Chang Yeon Kim, Ansan-si, KR;

Chung Hoon Lee, Ansan-si, KR;

Assignee:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/81 (2023.01); H01L 25/075 (2006.01); H01L 25/13 (2006.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/10 (2010.01); H01L 33/40 (2010.01); H01L 33/42 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H10K 50/82 (2023.01); H10K 59/32 (2023.01); H10K 59/35 (2023.01); H01L 25/065 (2023.01); H01L 25/11 (2006.01); H01L 33/38 (2010.01); H10K 10/84 (2023.01); H10K 50/813 (2023.01); H10K 50/818 (2023.01); H10K 50/822 (2023.01); H10K 50/828 (2023.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 25/0756 (2013.01); H01L 25/13 (2013.01); H01L 33/0093 (2020.05); H01L 33/10 (2013.01); H01L 33/405 (2013.01); H01L 33/42 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 25/0655 (2013.01); H01L 25/0753 (2013.01); H01L 25/115 (2013.01); H01L 33/38 (2013.01); H01L 33/382 (2013.01); H10K 10/84 (2023.02); H10K 50/813 (2023.02); H10K 50/818 (2023.02); H10K 50/822 (2023.02); H10K 50/828 (2023.02); H10K 59/32 (2023.02); H10K 59/35 (2023.02);
Abstract

A light emitting diode (LED) stack for a display including a first LED stack including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, an intermediate bonding layer disposed between the first LED stack and the second LED stack to bond the second LED stack to the first LED stack, an upper bonding layer disposed between the second LED stack and the third LED stack to couple the third LED stack to the second LED stack, and a first hydrophilic material layer disposed between the first LED stack and the upper bonding layer.


Find Patent Forward Citations

Loading…