The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Aug. 28, 2020
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Mitsuaki Kato, Kawasaki Kanagawa, JP;
Takahiro Omori, Kawasaki Kanagawa, JP;
Akihiro Goryu, Kanazawa Ishikawa, JP;
Tomoya Fumikura, Kawasaki Kanagawa, JP;
Kenji Hirohata, Koto Tokyo, JP;
Tetsuya Kugimiya, Kawasaki Kanagawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/66 (2020.01); G01R 27/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); G01R 27/08 (2013.01); G01R 31/66 (2020.01); H01L 24/49 (2013.01); H01L 2224/45111 (2013.01); H01L 2224/45123 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45155 (2013.01); H01L 2224/45157 (2013.01); H01L 2224/45166 (2013.01); H01L 2224/45179 (2013.01); H01L 2224/4518 (2013.01); H01L 2224/45181 (2013.01); H01L 2224/45184 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48458 (2013.01); H01L 2224/4852 (2013.01); H01L 2224/48723 (2013.01); H01L 2224/48747 (2013.01); H01L 2224/48755 (2013.01); H01L 2224/48757 (2013.01); H01L 2224/48766 (2013.01); H01L 2224/48779 (2013.01); H01L 2224/4878 (2013.01); H01L 2224/48781 (2013.01); H01L 2224/48784 (2013.01); H01L 2224/48823 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48857 (2013.01); H01L 2224/48866 (2013.01); H01L 2224/48879 (2013.01); H01L 2224/4888 (2013.01); H01L 2224/48881 (2013.01); H01L 2224/48884 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01087 (2013.01);
Abstract
A semiconductor deviceincludes a pair of electrodesand a conductive connection memberelectrically bonded to the pair of electrodes. At least a portion of a perimeter of a bonding surfaceof at least one of the pair of electrodesand the conductive connection memberincludes an electromigration reducing area