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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12040303 B1

PDFFull Text
Date of Patent:
Jul. 16, 2024

Filed:

Aug. 28, 2020

Semiconductor device and inspection device

Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Mitsuaki Kato, Kawasaki Kanagawa, JP;

Takahiro Omori, Kawasaki Kanagawa, JP;

Akihiro Goryu, Kanazawa Ishikawa, JP;

Tomoya Fumikura, Kawasaki Kanagawa, JP;

Kenji Hirohata, Koto Tokyo, JP;

Tetsuya Kugimiya, Kawasaki Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

Primary Examiner:

Thang X Le

Int. Cl.
CPC ...
G01R 31/66 (2020.01); G01R 27/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); G01R 27/08 (2013.01); G01R 31/66 (2020.01); H01L 24/49 (2013.01); H01L 2224/45111 (2013.01); H01L 2224/45123 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45155 (2013.01); H01L 2224/45157 (2013.01); H01L 2224/45166 (2013.01); H01L 2224/45179 (2013.01); H01L 2224/4518 (2013.01); H01L 2224/45181 (2013.01); H01L 2224/45184 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48458 (2013.01); H01L 2224/4852 (2013.01); H01L 2224/48723 (2013.01); H01L 2224/48747 (2013.01); H01L 2224/48755 (2013.01); H01L 2224/48757 (2013.01); H01L 2224/48766 (2013.01); H01L 2224/48779 (2013.01); H01L 2224/4878 (2013.01); H01L 2224/48781 (2013.01); H01L 2224/48784 (2013.01); H01L 2224/48823 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48857 (2013.01); H01L 2224/48866 (2013.01); H01L 2224/48879 (2013.01); H01L 2224/4888 (2013.01); H01L 2224/48881 (2013.01); H01L 2224/48884 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01087 (2013.01);
Abstract

A semiconductor deviceincludes a pair of electrodesand a conductive connection memberelectrically bonded to the pair of electrodes. At least a portion of a perimeter of a bonding surfaceof at least one of the pair of electrodesand the conductive connection memberincludes an electromigration reducing area

Find Patent Forward Citations

Kato, Mitsuaki. (2024). Semiconductor device and inspection device (U.S. Patent No. 12040303). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12040303

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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