The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Nov. 08, 2019
Rohm Co., Ltd., Kyoto, JP;
Katsuhiko Yoshihara, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
Semiconductor device Aof the present disclosure includes: semiconductor element(semiconductor elementsA andB) having element obverse face and element reverse face facing toward opposite sides in z direction; support substratesupporting semiconductor element; conductive block(first blockand second block) bonded to element obverse face via first conductive bonding material (block bonding materialsand); and metal member (lead memberand input terminal) electrically connected to semiconductor elementvia conductive block. Conductive blockhas a thermal expansion coefficient smaller than that of metal member. Conductive blockand metal member are bonded to each other by a weld portion (weld portions Mand M) at which a portion of conductive blockand a portion of metal member are welded to each other. Thus, the thermal cycle resistance can be improved.