The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Jul. 28, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Yiqi Tang, Allen, TX (US);

Rajen Manicon Murugan, Dallas, TX (US);

Li Jiang, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01P 3/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/13 (2013.01); H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01P 3/02 (2013.01); H05K 1/0243 (2013.01);
Abstract

In examples, a semiconductor package comprises a ceramic substrate and a horizontal metal layer covered by the ceramic substrate. The metal layer is configured to carry signals in the 5 GHz to 38 GHz frequency range. The package also includes a vertical castellation on an outer surface of the ceramic substrate, the castellation coupled to the metal layer and having a height ranging from 0.10 mm to 0.65 mm.


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