The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jul. 22, 2021
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Tsuyoshi Takakura, Kyoto-fu, JP;
Takafumi Kusuyama, Kyoto-fu, JP;
MURATA MANUFACTURING CO., LTD., Kyoto-Fu, JP;
Abstract
A module includes a substrate including a first main surface, a columnar conductor arranged on the first main surface, a first sealing resin that seals at least the columnar conductor and the first main surface while exposing a first end surface of the columnar conductor, a conductive film connected to the columnar conductor and arranged to extend laterally from the first end surface, a resin sheet arranged to cover at least the conductive film, a conductor via provided in the resin sheet and having one end connected to the conductive film, and a conductor pattern arranged on a surface of the resin sheet on a side far from the substrate to be connected to the other end of the conductor via and being larger in area than the first end surface.