The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Mar. 30, 2022
Applicant:
National Yang Ming Chiao Tung University, Hsinchu, TW;
Inventors:
Chih Chen, Hsinchu, TW;
Kang-Ping Lee, Hsinchu, TW;
Yu-I Chang, Zhubei, TW;
Yun-Hsuan Chen, Taichung, TW;
Assignee:
NATIONAL YANG MING CHIAO TUNG UNIVERSITY, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01); C22F 1/08 (2006.01); C25D 3/58 (2006.01); C25D 5/18 (2006.01); C25D 5/50 (2006.01);
U.S. Cl.
CPC ...
C22C 9/06 (2013.01); C22F 1/08 (2013.01); C25D 3/58 (2013.01); C25D 5/18 (2013.01); C25D 5/50 (2013.01);
Abstract
A nano-twinned Cu—Ni alloy layer is provided, wherein more than 50% in volume of the nano-twinned Cu—Ni alloy layer comprises plural twinned grains, the plural twinned grains comprise plural columnar twinned grains, and a Ni content in the nano-twinned Cu—Ni alloy layer is in a range from 0.05 at % to 20 at %. In addition, a method for manufacturing the aforesaid nano-twinned Cu—Ni alloy layer is also provided.