The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Feb. 07, 2020
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

John H. Martin, Oxnard, CA (US);

Julie Miller, Los Angeles, CA (US);

Brennan D. Yahata, Los Angeles, CA (US);

Jacob M. Hundley, Thousand Oaks, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); B22F 9/02 (2006.01); B23K 26/342 (2014.01); B33Y 70/00 (2020.01); C22C 5/02 (2006.01); C22C 5/06 (2006.01); C22C 11/00 (2006.01); C22C 12/00 (2006.01); C22C 13/00 (2006.01); C22C 14/00 (2006.01); C22C 16/00 (2006.01); C22C 18/00 (2006.01); C22C 19/03 (2006.01); C22C 19/07 (2006.01); C22C 21/00 (2006.01); C22C 22/00 (2006.01); C22C 27/00 (2006.01); C22C 27/02 (2006.01); C22C 27/04 (2006.01); C22C 27/06 (2006.01); C22C 28/00 (2006.01); C22C 38/00 (2006.01); C22C 49/14 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); B22F 9/02 (2013.01); B23K 26/342 (2015.10); B33Y 70/00 (2014.12); C22C 5/02 (2013.01); C22C 5/06 (2013.01); C22C 11/00 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); C22C 14/00 (2013.01); C22C 16/00 (2013.01); C22C 18/00 (2013.01); C22C 19/03 (2013.01); C22C 19/07 (2013.01); C22C 21/00 (2013.01); C22C 22/00 (2013.01); C22C 27/00 (2013.01); C22C 27/02 (2013.01); C22C 27/04 (2013.01); C22C 27/06 (2013.01); C22C 28/00 (2013.01); C22C 38/00 (2013.01); C22C 49/14 (2013.01); B22F 2304/10 (2013.01); B33Y 10/00 (2014.12);
Abstract

Some variations provide a metal-alloy biphasic system containing a first metal Mand a second metal M, wherein a second metal phase has a melting temperature lower than that of a first metal phase, and wherein the metal-alloy biphasic system has a hierarchical microstructure containing a second length scale that is at least one order of magnitude smaller than a first length scale. Some variations provide a metal-alloy biphasic system containing a first metal Mand a second metal M, wherein a second metal phase has a melting temperature lower than that of a first metal phase, and wherein the first metal phase forms a continuous network. Other variations provide a metal-alloy biphasic powder containing at least a first metal and a second metal, wherein the solubility of first metal in second metal is less than 5%. Methods of making and using the powders and biphasic system are disclosed.


Find Patent Forward Citations

Loading…