The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Nov. 15, 2021
Applicant:
Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;
Inventors:
Assignee:
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., Kunshan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/00 (2006.01); C08J 5/24 (2006.01); C08L 25/02 (2006.01); C09J 7/30 (2018.01); C09J 125/02 (2006.01); C09J 171/00 (2006.01);
U.S. Cl.
CPC ...
C08L 71/00 (2013.01); C08J 5/244 (2021.05); C08L 25/02 (2013.01); C09J 7/30 (2018.01); C09J 125/02 (2013.01); C09J 171/00 (2013.01); C08J 2309/06 (2013.01); C08J 2325/02 (2013.01); C08J 2371/12 (2013.01); C08J 2425/02 (2013.01); C08J 2471/12 (2013.01); C08L 2205/035 (2013.01); C09J 2400/14 (2013.01); C09J 2400/163 (2013.01); C09J 2409/00 (2013.01); C09J 2423/00 (2013.01); C09J 2471/00 (2013.01);
Abstract
A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.