The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Nov. 29, 2019
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Momoko Yamashita, Hiratsuka, JP;
Kazuya Sato, Hiratsuka, JP;
Hatsuki Oguro, Hiratsuka, JP;
Takafumi Oda, Hiratsuka, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
To provide a polyamide resin composition preventing mold fouling during molding and capable of producing a molded product with an excellent color tone, as well as a molded product, a method for producing a molded product, and an antioxidant. The composition is a resin composition containing: a polyamide resin constituted of diamine-derived constituent units and dicarboxylic acid-derived constituent units, 70 mol % or more of the diamine-derived constituent units being derived from a compound represented by Formula (1), and 70 mol % or more of the dicarboxylic acid-derived constituent units being derived from an α,ω-linear aliphatic dicarboxylic acid having from 8 to 12 carbon atoms; and a compound represented by Formula (1), where Rand Reach independently represent an alkyl group having from 1 to 4 carbon atoms, and n1 and n2 are each independently an integer from 0 to 4, wherein a content of the compound represented by Formula (1) is from 3 to 100 mass ppm of the resin composition.