The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
May. 27, 2021
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 3/02 (2006.01); B32B 3/26 (2006.01); B32B 7/025 (2019.01); B32B 7/027 (2019.01); B32B 15/08 (2006.01); B32B 27/18 (2006.01); B32B 27/30 (2006.01); B32B 37/10 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 3/02 (2013.01); B32B 3/266 (2013.01); B32B 15/08 (2013.01); B32B 27/18 (2013.01); B32B 27/304 (2013.01); B32B 37/10 (2013.01); H05K 1/028 (2013.01); H05K 1/036 (2013.01); H05K 1/115 (2013.01); H05K 3/321 (2013.01); H05K 3/4046 (2013.01); H05K 3/4076 (2013.01); H05K 3/429 (2013.01); H05K 3/4623 (2013.01); B32B 7/025 (2019.01); B32B 7/027 (2019.01); B32B 2305/34 (2013.01); B32B 2305/55 (2013.01); B32B 2307/202 (2013.01); B32B 2307/536 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); H05K 2203/0235 (2013.01);
Abstract
A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.