The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Mar. 28, 2022
Applicant:

Chang Chun Petrochemical Co., Ltd., Taipei, TW;

Inventors:

Yen-Chen Huang, Taipei, TW;

Tzu-Jung Huang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10761 (2013.01); B32B 17/10036 (2013.01); B32B 17/10605 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 2307/732 (2013.01);
Abstract

A polymer film and laminated glass manufactured using the polymer film. The polymer film includes a first and second layer, and a third layer disposed between the first and second layers, and the two surfaces of the third layer are in contact with the first and second layers, respectively. The surface of the first layer that is not in contact with the third layer is a first surface, and the surface of the second layer not in contact with the third layer is a second surface, wherein the first surface has a void volume (Vv) value at a material ratio of 10% ranging from 3 μm/μmto 30 μm/μmand a dale void volume (Vvv) at a material ratio of 80% less than 2 μm/μm, and the ratio of the maximum pit height (Sv) of the first surface to the thickness of the first layer is 0.2 or less.


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