The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Sep. 05, 2019
Applicant:

Evolve Additive Solutions, Inc., Minnetonka, MN (US);

Inventors:

Arun Chowdry, Maple Grove, MN (US);

James W. Comb, Hamel, MN (US);

Chris Counts, Crystal, MN (US);

J. Samuel Batchelder, Somers, NY (US);

Assignee:

Evolve Additive Solutions, Inc., Minnetonka, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/147 (2017.01); B29C 64/393 (2017.01); B33Y 50/02 (2015.01); G03G 15/22 (2006.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/147 (2017.08); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); G03G 15/224 (2013.01); B33Y 30/00 (2014.12);
Abstract

A method for making a three-dimensional (3D) part with an electrostatographic based additive manufacturing system includes developing a first layer of a powder material using at least one electrostatographic engine, supporting the developed first layer on a transfer medium, adjusting a first layer thermal profile of the developed first layer with a first thermal flux device, adding thermal energy to a part thermal profile that includes a bonding region of previously accumulated layers of the 3D part, transfusing the developed first layer on the bonding region of the previously accumulated layers of the 3D part, and removing thermal energy from the part thermal profile. A transfusion temperature at a start of the transfusing step can be equal to or greater than a transfusion threshold temperature, where the transfusion temperature is an average of the first layer thermal profile and the part thermal profile in the bonding region.


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