The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Nov. 02, 2022
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Hyundai Transys Inc., Chungcheongnam-do, KR;

Inventors:

Sang-Hark Lee, Incheon, KR;

Sang-Do Park, Gyeonggi-do, KR;

Deok-Soo Lim, Gyeonggi-do, KR;

Chan-Ho Jung, Gyeonggi-do, KR;

Sang-Soo Lee, Gyeonggi-do, KR;

Beom-Sun Kim, Gyeonggi-do, KR;

Sang-In Woo, Gyenggi-do, KR;

Hyun-Seok Song, Jeollanam-do, KR;

Assignees:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Hyundai Transys Inc., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/14 (2006.01); B29C 45/14 (2006.01); B29C 45/26 (2006.01); B29C 45/37 (2006.01); B29L 31/00 (2006.01); B29L 31/58 (2006.01);
U.S. Cl.
CPC ...
B29C 45/2675 (2013.01); B29C 33/14 (2013.01); B29C 45/14 (2013.01); B29C 45/2602 (2013.01); B29C 45/37 (2013.01); B29L 2031/58 (2013.01); B29L 2031/771 (2013.01);
Abstract

Provided is a mold for a seat pad with a mesh fixed, which can easily fix a mesh to be inserted in a molding process. The mold includes a plurality of mold members overlapping each other and molding a seat pad by foaming a resin injected into a space formed between the mold members, the mold members are formed with a mesh accommodating groove accommodating a mesh, and the mesh is fitted into and fixed to the mesh-accommodating groove.


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