The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Apr. 28, 2023
Applicant:
Aptiv Technologies Ag, Schaffhausen, CH;
Inventors:
Stephen Antaya, West Kingston, RI (US);
William Falk, Warwick, RI (US);
Justin Amalfitano, East Providence, RI (US);
Amit Datta, East Greenwich, RI (US);
Assignee:
APTIV TECHNOLOGIES AG, Schaffhausen, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 103/00 (2006.01); B23K 103/02 (2006.01); B23K 103/12 (2006.01); C22C 13/00 (2006.01); C22C 30/04 (2006.01); C22C 30/06 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); C22C 30/04 (2013.01); C22C 30/06 (2013.01); B23K 2103/02 (2018.08); B23K 2103/12 (2018.08); B23K 2103/54 (2018.08); Y10T 428/12597 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01);
Abstract
An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.