The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Apr. 03, 2020
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Subramanian Vasudevan, Cedar Park, TX (US);

Edward Rhem, Leander, TX (US);

Philip Conde, Austin, TX (US);

Wallace Ables, Georgetown, TX (US);

Edwin C. Tinsley, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); B23K 1/0016 (2013.01); B23K 35/262 (2013.01); H05K 3/3421 (2013.01); H05K 3/3489 (2013.01); B23K 2101/42 (2018.08);
Abstract

Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.


Find Patent Forward Citations

Loading…