The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Oct. 12, 2021
Applicant:

Guangzhou Luxvisions Innovation Technology Limited, Guangzhou, CN;

Inventors:

Andu Zhou, Guangzhou, CN;

Bingfeng Luo, Guangzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49421 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H05K 2201/094 (2013.01);
Abstract

A circuit structure including a pad assembly, a bonding pad assembly, and a bonding assembly is provided. The pad assembly includes a first pad, a second pad, and a third pad which are separated from one another. The bonding pad assembly is located on one side of the pad assembly and includes a first bonding pad. The bonding assembly includes a first bonding wire, a second bonding wire, and a plurality of bonding members. The first bonding wire is connected to the first bonding pad and the first pad. The second bonding wire is connected to the first bonding pad and the third pad. The bonding members are connected among the first pad, the second pad, and the third pad. The circuit structure provided here may have an improved wire bonding efficiency and an increased distribution density of bonding points, and the number of bonding wires may be reduced.


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