The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Nov. 13, 2019
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Kenjiro Koshiji, Tsukuba, JP;
Yuichi Makita, Tsukuba, JP;
Noriaki Nakamura, Tsukuba, JP;
Masato Kasuga, Tsukuba, JP;
Yuusuke Ohshima, Tsukuba, JP;
Hiroki Sato, Tsukuba, JP;
Hitoshi Kubo, Tsukuba, JP;
TANAKA KIKINZOKU KOGYO K.K., Tokyo, JP;
Abstract
An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.