The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Sep. 10, 2021
Applicant:
Continental Automotive Systems, Inc., Auburn Hills, MI (US);
Inventors:
Stanton F Rak, Evanston, IL (US);
David Tseung, Chicago, IL (US);
Assignee:
Continental Automotive Systems, Inc., Auburn Hills, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B29C 64/118 (2017.01); B29L 31/34 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 1/181 (2013.01); H05K 3/0044 (2013.01); H05K 3/284 (2013.01); B29L 2031/3425 (2013.01); H05K 2201/09045 (2013.01); H05K 2203/1305 (2013.01);
Abstract
A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.