The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Jun. 06, 2022
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Mingzhu Wang, Ningbo, CN;

Bojie Zhao, Ningbo, CN;

Zhenyu Chen, Ningbo, CN;

Nan Guo, Ningbo, CN;

Takehiko Tanaka, Ningbo, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); G02B 7/00 (2021.01); G02B 7/02 (2021.01); G03B 13/36 (2021.01); H01L 27/146 (2006.01); H04N 23/45 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H04N 23/90 (2023.01); H05K 1/18 (2006.01); G02B 5/20 (2006.01); G02B 7/08 (2021.01); G02B 7/09 (2021.01); H02K 41/035 (2006.01); H02N 2/02 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H04N 23/55 (2023.01); G02B 7/006 (2013.01); G02B 7/02 (2013.01); G03B 13/36 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01); H04N 23/45 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H04N 23/90 (2023.01); H05K 1/182 (2013.01); G02B 5/208 (2013.01); G02B 7/021 (2013.01); G02B 7/08 (2013.01); G02B 7/09 (2013.01); H01L 27/14636 (2013.01); H01L 2224/48091 (2013.01); H02K 41/0354 (2013.01); H02N 2/026 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/1316 (2013.01);
Abstract

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.


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