The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Feb. 28, 2020
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Mingzhu Wang, Zhejiang, CN;

Takehiko Tanaka, Zhejiang, CN;

Zhen Huang, Zhejiang, CN;

Zhenyu Chen, Zhejiang, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); G03B 11/00 (2021.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01);
U.S. Cl.
CPC ...
H04N 23/55 (2023.01); G03B 11/00 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01);
Abstract

Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.


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