The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

May. 18, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Masahiro Yamamoto, Kariya, JP;

Akimasa Niwa, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/687 (2006.01); H03K 17/00 (2006.01); H03K 17/081 (2006.01); H03K 17/082 (2006.01); H03K 17/18 (2006.01);
U.S. Cl.
CPC ...
H03K 17/687 (2013.01); H03K 17/002 (2013.01); H03K 17/08104 (2013.01); H03K 17/0822 (2013.01); H03K 17/18 (2013.01); H01L 2924/19041 (2013.01); H03K 2217/0054 (2013.01);
Abstract

A signal detection circuit includes: a voltage dividing circuit having at least a first pair of voltage dividing capacitors connected in series for dividing an input voltage and configured to output a divided voltage, and a detection circuit configured to detect the divided voltage. The first pair of voltage dividing capacitors are included in one semiconductor device. The semiconductor device includes: (i) a semiconductor substrate, (ii) a first conductor layer, (iii) a first dielectric layer, (iv) a second conductor layer, (v) a second dielectric layer, (vi) a third conductor layer, and (vii) a short-circuit portion configured to short-circuit the first conductor layer and the semiconductor substrate.


Find Patent Forward Citations

Loading…