The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Jun. 06, 2019
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Ryota Aizaki, Tochigi, JP;

Kosuke Asaba, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/00 (2006.01); H01R 4/04 (2006.01); H01R 12/62 (2011.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 4/04 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01R 12/62 (2013.01); H05K 1/092 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01);
Abstract

A connection body, a method for manufacturing a connection body, and a connection method which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. In a connection body in which a first component having a first electrode and a second component having a second electrode are connected to each other via a filler-containing film having a filler-aligned layer in which independent fillers are aligned in a binder resin layer, the maximum effective connection portion area where the first electrode and the second electrode face each other is 4,000 μmor less and a ratio of the effective connection portion area to a particle area on the connection portion projection plane is 3 or more.


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