The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Jul. 21, 2022
Applicant:
Ses Rfid Solutions Gmbh, Dusseldorf, DE;
Inventors:
Shao-Lun Liaw, Taichung, TW;
Yu-Cheng Li, Taichung, TW;
Assignee:
SES RFID SOLUTIONS GmbH, Dusseldorf, DE;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/36 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 1/36 (2013.01);
Abstract
A chip packaging structure includes a chip module and a main body, wherein the main body has a first portion, a second portion, and a holding portion. The second portion protrudes from the first portion, and a size of the second portion is less than a size of the first portion. The holding portion is located at the second portion, and the chip module is placed at the holding portion to be engaged with the main body.