The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Jan. 16, 2017
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Sang-Il Son, Daejeon, KR;

Ha-Neul Yoo, Daejeon, KR;

Yun-Ki Choi, Daejeon, KR;

Jong-Soo Ha, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 10/6568 (2014.01); B60L 50/64 (2019.01); H01M 10/613 (2014.01); H01M 10/617 (2014.01); H01M 10/625 (2014.01); H01M 10/647 (2014.01); H01M 10/6551 (2014.01); H01M 10/6554 (2014.01); H01M 10/6555 (2014.01); H01M 10/6556 (2014.01); H01M 50/211 (2021.01); H01M 50/249 (2021.01);
U.S. Cl.
CPC ...
H01M 10/6568 (2015.04); B60L 50/64 (2019.02); H01M 10/613 (2015.04); H01M 10/617 (2015.04); H01M 10/625 (2015.04); H01M 10/647 (2015.04); H01M 10/6551 (2015.04); H01M 10/6554 (2015.04); H01M 10/6555 (2015.04); H01M 10/6556 (2015.04); H01M 50/211 (2021.01); H01M 50/249 (2021.01); H01M 2220/20 (2013.01); Y02E 60/10 (2013.01); Y02T 10/70 (2013.01);
Abstract

According to an embodiment of the present disclosure, a battery module includes: a cartridge including an accommodation space therein; a plurality of battery cells placed in the accommodation space; a cooling unit configured to cool the battery cells; and a heat exchange unit configured to exchange heat with the cooling unit, wherein the heat exchange unit includes: a heat exchange chamber having an inner space; a lower cooling flow path located in the heat exchange chamber and through which a cooling fluid flows; an upper cooling flow path located above the lower cooling flow path and through which the cooling fluid supplied from the lower cooling flow path flows; and a connection flow path configured to supply the cooling fluid flowing in the lower cooling flow path to the upper cooling flow path.


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