The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

May. 26, 2021
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Hans Weber, Bayerisch Gmain, DE;

Ingo Muri, Villach, AT;

Daniel Tutuc, St. Niklas an der Drau, AT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/225 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/223 (2006.01); H01L 21/306 (2006.01); H01L 29/16 (2006.01); H01L 29/167 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 21/2253 (2013.01); H01L 21/26513 (2013.01); H01L 21/26586 (2013.01); H01L 21/324 (2013.01); H01L 29/0684 (2013.01); H01L 29/0696 (2013.01); H01L 29/0878 (2013.01); H01L 29/66666 (2013.01); H01L 29/66712 (2013.01); H01L 29/66734 (2013.01); H01L 29/7802 (2013.01); H01L 29/7805 (2013.01); H01L 29/7827 (2013.01); H01L 21/223 (2013.01); H01L 21/30604 (2013.01); H01L 29/1608 (2013.01); H01L 29/167 (2013.01); H01L 29/7813 (2013.01);
Abstract

A method for forming a drift region of a superjunction transistor and a superjunction transistor device are disclosed. The method includes forming first regions of a first doping type and second regions of a second type in a semiconductor body such that the first and second regions are arranged alternatingly in the body. The first and second regions are formed by: forming trenches in at least one semiconductor layer; implanting first type dopant atoms and second type dopant atoms into opposing sidewalls of the trenches; filling the trenches with a semiconductor material; and diffusing the dopant atoms in a thermal process so that the first type dopant atoms form the first regions and the second type dopant atoms form the second regions. Each trench has a first width, the trenches are separated by mesa regions each having a second width, and the first width is greater than the second width.


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