The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2024

Filed:

Feb. 23, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Tang Chin Hung, Miao-Li County, TW;

Chin-Lung Ting, Miao-Li County, TW;

Chung-Kuang Wei, Miao-Li County, TW;

Ker-Yih Kao, Miao-Li County, TW;

Tong-Jung Wang, Miao-Li County, TW;

Chih-Yung Hsieh, Miao-Li County, TW;

Hao Jung Huang, Miao-Li County, TW;

I-Yin Li, Miao-Li County, TW;

Chia-Chi Ho, Miao-Li County, TW;

Yi Hung Lin, Miao-Li County, TW;

Cheng-Hsu Chou, Miao-Li County, TW;

Chia-Ping Tseng, Miao-Li County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 21/8234 (2006.01); H01L 23/522 (2006.01); H01L 29/93 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/823475 (2013.01); H01L 23/5223 (2013.01); H01L 29/93 (2013.01); H01L 23/5385 (2013.01); H01L 27/0694 (2013.01);
Abstract

The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.


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