The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Dec. 10, 2021
Applicant:
Amazon Technologies, Inc., Seattle, WA (US);
Inventor:
Bassam Abdel-Dayem, Santa Clara, CA (US);
Assignee:
Amazon Technologies, Inc., Seattle, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/50 (2013.01); H01L 23/34 (2013.01); H01L 23/3675 (2013.01); H01L 23/49833 (2013.01);
Abstract
A stiffener ring can include a body sized for attachment to a substrate in a semi-conductor package. The stiffener ring body can have a top surface and a bottom surface. A through-hole may penetrate the body so as to extend through the top surface and the bottom surface and so that the body is formed as ring around the through-hole. An anchor surface can form a portion of the bottom surface and be configured for engaging the substrate. An elevated surface can also form a portion of the bottom surface and be elevated above the anchor surface.